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YNV05T10 DC-DC Converter Data Sheet
3.0-5.5 VDC Input; 0.7525-3.63 VDC Programmable @ 10A
The
Products: Y-Series
Features
? RoHS lead free solder and lead solder exempted
products are available
? Delivers up to 10 A (36.3 W)
? No derating up to 85 ? C
? Industry-standard footprint and pinout
? Single-in-Line Package (SIP): 2.0” x 0.535” x 0.28”
Applications
(50.8 x 13.59 x 7.11 mm)
? Weight: 0.26 oz [7.28 g]
?
?
?
?
?
Intermediate Bus Architectures
Telecommunications
Data communications
Distributed Power Architectures
Servers, workstations
? Synchronous Buck Converter topology
? Start-up into pre-biased output
? No minimum load required
? Programmable output voltage via external resistor
? Operating ambient temperature: -40 °C to 85 °C
? Remote output sense
? Remote ON/OFF (positive or negative)
Benefits
? High efficiency – no heat sink required
? Reduces total solution board area
? Minimizes part numbers in inventory
? Fixed-frequency operation
? Auto-reset output overcurrent protection
? Auto-reset overtemperature protection
? High reliability, MTBF = TBD million hours
? All materials meet UL94, V-0 flammability rating
? UL 60950 recognition in U.S. & Canada, and DEMKO
certification per IEC/EN 60950
Description
Power-One’s point-of-load converters are recommended for use with regulated bus converters in an
Intermediate Bus Architecture (IBA). The YNV05T10 non-isolated DC-DC converter delivers up to 10 A of
output current in an industry-standard through-hole Single In-Line Package (SIP). Operating from a 3.0 – 5.5
V input, this converter is an ideal choice for Intermediate Bus Architectures where point-of-load power delivery
is generally a requirement. The YNV05T10 provides an extremely tight regulated programmable output
voltage from 0.7525 V to 3.63 V.
YNV05T10 converters provide exceptional thermal performance, even in high temperature environments with
minimal airflow. No derating is needed up to 85 ? C under natural convection conditions. This is accomplished
through the use of circuitry, packaging, and processing techniques to achieve ultra-high efficiency and
excellent thermal management, along with a very sleek body profile.
The sleek body profile and the preclusion of heat sinks minimize impedance to system airflow, thus enhancing
cooling for both upstream and downstream devices. The use of 100% automation for assembly, coupled with
advanced power electronics and thermal design, results in a product with extremely high reliability.
MCD10198 Rev. 1.0, 23-Jun-10
Page 1 of 26
www.power-one.com
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